Category: Project

We designed a satellite … nah just kidding but we did work on device which is a part of the Cube Satellite, device that allows for CubeSat position it self for maximum sun light input. Device is ultra small and utilizes IR camera and thermal sensor to determine the angle of the Sun relative to the device sensor normal axis. This is by far most expensive device from sensor perspective that we have designed and assembled… yes by hand!

Requirements:

• CMOS 650×480 250FPS sensor,
• Remote IR Thermal sensing 32×24 pixel grid,
• Azimut calculation,
• I2C slave.

Major components:

• STM32F732
• MLX90640
• NOIL1SM0300A
• TLV76701

Number of PCB layers: 4

BOM price: 253 USD

Realization time: 7 weeks

This is one of that devices that had too many revisions, not by error but due to client requirements evolving from one to another version. It started as a simple what-if a project with 2 layer board and ended up with 8 layer board with a dual-core ARM Cortex MCU. The device is designed to capture gray-scale images of rotating objects with high FPS and detect certain artifacts on the images. Once detected the device initiates a series of movements via stepper/servo motors in order to align the object to the desired position.

Requirements:

• Grayscale image capture 320×240
• Image processing,
• Servo & Stepper motor control.

Major components:

• STM32H745
• GC0308
• IS42S16400
• DRV8836
• TPS61023 & TPS7A02xx

Number of PCB layers: 8

BOM price: 70 USD

Realization time: 24 weeks

Its always fun to design with STM32H7 MCU’s as they allow wide spectrum of peripherals and this is one such project which has almost all of them utilized. Device plays fast sequence of JPEG images by decompressing them and pushing via MIPI DSI interface to AMOLED display.

Requirements:

• AMOLED MIPI DSI display,
• BLE/WiFi interface for device configuration and image upload,
• Image loading and storage into parallel NAND flash,
• Audio and vibration actuation,
• Motion tracking,
• Ambient light sensing,
• Low power profile.

Major components:

• STM32H747 Dual Core ARM Cortex MCU,
• LBEE5HY1MW & ST2378,
• OK-23GM010-04,
• MT29F8G08, SST26VF032 & IS42S16400
• LSM6DSO, PAM8301, OPT3001
• BQ25892,  TPS61023 & LD39200

Number of PCB layers: 8

BOM price: 125 USD

This device has the ability to control arbitrary type of the smart LEDs (APA102,WS2812,SK6812 etc.) with the predefined animations. OTA firmware upgrade and configuration of the device is done through the Bluetooth LE interface. Board utilizes the USB C connector for the purpose of charging of external devices with multiple PD profiles.

Requirements:

• Generic smart LED controller
• BLE/WiFi interface for device configuration
• Firmware upgrade via BLE interface
• USBC PD controller

Major components:

• STM32F446 + STM32G071
• ATWINC3400
• TCPP03 USB PD3.0
• SST26VF032

Number of PCB layers: 4

BOM price: 99 USD

Realization time: 8 weeks

A BLE enabled UV light level measurement device which sends the notification to mobile device once the certain threshold is exceeded. This was a two phase project where the device size is reduce significantly due to mechanical constraint. Device wake-up achieved through the simple motion detected by the accelerometer.

Requirements:

• BLE communication interface for device configuration,
• UV Light sensing,
• Motion detection,
• Low power profile and power supply via CR2450.

Major components:

• nRF51822
• ADXL362
• SI1133
• PCF8563

Number of PCB layers: 4

BOM price: 35 USD

Realization time: 10 weeks