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Device designed to allow control wireless access and control of three 110/220VAC loads up to 8A. Device configuration is implemented through the TFT LCD touch interface.

Requirements:

• WiFi communication interface,
• AC load control,
• TFT LCD 480×272 interface with capacitive touch,
• Serial flash memory,

Major components:

• ESP8266
• PCF8574
• MOC3010 & BT137
• RA8875 LCD controller

Number of PCB layers: 4

BOM price: 53 USD

Realization time: 7 weeks

Comprehensive slave board designed as an extension to SBC (RPI or Radax board) in order to achieve control of 12 AC sprinkler valves. Water detection and temperature monitoring are implemented on slave board. For each load current consumption is measured

Requirements:

• BLE interface for device configuration
• BLE signal monitoring
• Inductive battery charging
• Audio signal for out of range indication
• Small and compact size

Major components:

• STM32F407
• ACS712, MOC3010 & BT139
• LM358, 74HC4067
• LM2596, TPS78633

Number of PCB layers : 4

Realization time: 8 weeks

BOM price: 177 USD

For a group of analog gas sensors there was a requirement for the design of the generic cape board that will allow analog data conditioning and amplification and then conversion into digital data.

Requirements:

• Analog front end for range of gas sensors,
• Analog to digital conversion,
• Serial interface I2C,
• PCB panelization.

Major components:

• LPM91000
• MSP430FR2311

Number of PCB layers : 4

Realization time: 2 weeks

BOM price: 9 USD

Low power BLE enabled CO2 and NO2 gas monitoring device. Beside the gas level monitoring device allows for ambient temperature monitoring and setting the thresholds for all sensors to generate alarm notifications. Device BLE interface is activated through the predefined period time (for mobile phone to achieve connection) through the simple shake of the device.

Requirements:

• BLE interface for device configuration,
• CO2, NO2 and temperature monitoring,
• Motion detection
• Audio signal for out of range indication
• Small and compact size

Major components:

• nRF51822 BLE SoC
• MCP6042 & ECS1, COZIR
• ADXL362
• PCF8563
• TPS61220

Number of PCB layers : 4

Realization time: 8 weeks

BOM price: 177 USD